Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Radiation sensitive composition or product or process of making
Reexamination Certificate
2006-05-02
2006-05-02
Angebranndt, Martin (Department: 1756)
Radiation imagery chemistry: process, composition, or product th
Imaging affecting physical property of radiation sensitive...
Radiation sensitive composition or product or process of making
C430S285100, C430S321000, C385S143000, C385S129000, C385S130000
Reexamination Certificate
active
07037637
ABSTRACT:
A photosensitive polyimide resin precursor composition capable of providing a polyimide resin that is not substantially colored, is transparent and has heat resistance, an optical polyimide resin obtained from the composition, and an optical waveguide using the polyimide resin. The photosensitive polyimide resin precursor composition contains (a) 100 parts by weight of a polyamic acid obtained from a tetracarboxylic acid dianhydride and a diamine, (b) 0.01 parts by weight or more and less than 5 parts by weight of a 1,4-dihydropyridine derivative, (c) 5–50 parts by weight of a glycol (ether). The optical polyimide resin is obtained by irradiating the photosensitive resin precursor composition with UV light, followed by exposure, heating, development, and then heating. The optical waveguide comprises a core layer comprising the optical polyimide resin, and a cladding layer thereof.
REFERENCES:
patent: 5081000 (1992-01-01), Kuehn et al.
patent: 5317082 (1994-05-01), Beuhler et al.
patent: 5719253 (1998-02-01), Echigo et al.
patent: 5849934 (1998-12-01), Ando et al.
patent: 6047098 (2000-04-01), Sagawa et al.
patent: 6549714 (2003-04-01), Kim et al.
patent: 6746816 (2004-06-01), Hayashi et al.
patent: 6800425 (2004-10-01), Naitou et al.
patent: 2002/0051614 (2002-05-01), Teramoto et al.
patent: 2003/0108748 (2003-06-01), Shigeta et al.
patent: 2004/0131324 (2004-07-01), Mune et al.
patent: 2004/0146263 (2004-07-01), Mune et al.
patent: 2004/0178522 (2004-09-01), Oe et al.
patent: 1103855 (2001-05-01), None
patent: 1 205 804 (2002-05-01), None
patent: 2002-356615 (2002-12-01), None
Fujii Hirofumi
Fukuoka Takahiro
Hayashi Shun-ichi
Mochizuki Amane
Mune Kazunori
Angebranndt Martin
Nitto Denko Corporation
Sughrue & Mion, PLLC
LandOfFree
Photosensitive polyimide resin precursor composition,... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Photosensitive polyimide resin precursor composition,..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Photosensitive polyimide resin precursor composition,... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3620089