Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Radiation sensitive composition or product or process of making
Patent
1999-09-24
2000-11-07
Chu, John S.
Radiation imagery chemistry: process, composition, or product th
Imaging affecting physical property of radiation sensitive...
Radiation sensitive composition or product or process of making
430326, 430330, 430906, 430176, 525425, 525433, G03F 7004, C08F28304, C08L 7710
Patent
active
061434671
ABSTRACT:
A heat resistant positive-working photosensitive composition that has a polybenzoxazole precursor bearing acid labile functional groups, a photoacid generator, a photosensitizer, and a solvent. The polybenzoxazole precursor bearing acid labile functional groups, has the structure: ##STR1## wherein k.sub.1 is an integer of 1 or 2, k.sub.2 is an interger of 0 or 1, and the sum of k.sub.1 and k.sub.2 is 2; Ar.sub.1 is a tetravalent aromatic, aliphatic, or heterocyclic group, or mixtures thereof; Ar.sub.2 is a divalent aromatic, aliphatic, or heterocyclic group or siloxane group; D is a monovalent acid labile group; and n is an integer from 20 to 200. A portion of Ar.sub.1 can be a divalent aromatic, aliphatic, or heterocyclic diamine moiety such that the fraction of diamine compound is 0-60 mole percent and the sum of diamine and diamino dihydroxy compound is 100%.
Preparation of chemical amplification based positive-working, aqueous base developable photosensitive polybenzoxazole (PBO) precursors, the formulation of the resin composition, and the process for preparing heat-resistant relief structures from this resin composition. The positive photosensitive resin compositions are suitable especially for applications in microelectronics.
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Blakeney Andrew J.
Hsu Steve Lien-Chung
Malik Sanjay
Naiini Ahmad
Waterson Pamela J.
Arch Specialty Chemicals, Inc.
Chu John S.
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