Photosensitive polyamide resin composition

Details Photosensitive polyamide resin composition Photosensitive polyamide resin composition

1980-07-24

1982-04-06

Brammer, Jack P.

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Radiation sensitive composition or product or process of making

430283, 430300, 430306, 20415915, 20415918, 528335, G03C 168

Patent

active

043236391

ABSTRACT:
A photosensitive resin composition comprising a polyamide containing 10 to 70% by weight of a polyoxyethylene segment or poly(oxyethylene/oxypropylene) copolymer segment having a number average molecular weight of from 150 to 1,500 in its molecular chain, and a photopolymerizable unsaturated compound. This composition exhibits excellent flexibility and water- and alcohol-developability, and results in a printing plate exhibiting excellent transparency, toughness and printing durability.

REFERENCES:
patent: 3486903 (1969-12-01), Henkler
patent: 3551148 (1970-12-01), Fauchaber et al.
patent: 3882090 (1975-05-01), Fagerburg et al.

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