Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Radiation sensitive composition or product or process of making
Patent
1993-05-21
2000-04-04
Codd, Bernard
Radiation imagery chemistry: process, composition, or product th
Imaging affecting physical property of radiation sensitive...
Radiation sensitive composition or product or process of making
4302871, 4302881, 430906, 430920, 430925, G03C 173
Patent
active
060459751
ABSTRACT:
The film forming, photosensitive, heat-resistant resin composition comprising a varnish of a polyimide precursor having no photosensitivity in itself, a polymerizable monomer or oligomer compatible with said varnish and capable of providing a high-heat-resistant polymer upon being polymerized, and a polymerization initiator for said monomer or oligomer. The resin composition is useful for the production of circuit substrates and semiconductor devices for high-density mounting including multi-chip modules or the like, such as printed circuits, printed boards, wiring boards and electronic components, since it can effectively avoid a reduction of the layer thickness during the film formation, and ensures a low cost production process. The pattern formation process using the such resin composition is also disclosed.
REFERENCES:
patent: 3615454 (1971-10-01), Cescon et al.
patent: 4048035 (1977-09-01), Ide et al.
patent: 4243743 (1981-01-01), Hiramoto et al.
patent: 4389504 (1983-06-01), St. Clair
patent: 4395518 (1983-07-01), Giles, Jr. et al.
patent: 4416973 (1983-11-01), Goff
patent: 4430418 (1984-02-01), Goff
patent: 4454220 (1984-06-01), Goff
patent: 4537855 (1985-08-01), Ide
patent: 4565767 (1986-01-01), Kataoka et al.
patent: 4579809 (1986-04-01), Irving
patent: 4962011 (1990-10-01), Aldag et al.
patent: 4987188 (1991-01-01), Furno et al.
patent: 5438105 (1995-08-01), Nagata
Patent Abstracts of Japan, vol. 12, No. 453 (P-792) (3300), Nov. 29, 1988 (JP 63-175854).
World Patents Index, An 80-10213C, Week 8006, Dec. 24, 1979 (JP 54-162798), Derwent Publications Ltd., London, GB.
Yoda and Hiramoto, New Photosensitive High Temperature Polymers for Electronic Applications, J. Macromol. SCL-CHEM., A21 (13 & 14), pp. 1641-1663 (1984).
Photopolymer Handbook, Jun. 26, 1989, pp. 270-279, Kogyo Chosakai Publishing Co., Ltd.
U.S. application No. 08/772,260, Tani et al., filed Dec. 23, 1996 Fujitsu Limited.
U.S. application No. 08/418,169, Tani et al., Apr. 6, 1995 Fujitsu Limited.
Tani et al, "Photosensitive Dielectric Film Developed Using a Polymer Blend" Mat. Res. Soc. Symp Proc. vol. 264 p. 37-42, 1992.
Horikoshi et al, "Thin-Film Circuit Board Using a Polymer Blend Dielectric," ICEMM Proceedings '93 p. 266-270, 1993.
Hawley's Condensed Chemical Dictionary, 10th Ed. p. 699, 1977.
Horikoshi Eiji
Ito Takashi
Miyahara Shoichi
Sasaki Makoto
Tani Motoaki
Codd Bernard
Fujitsu Limited
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