Photosensitive element, resist pattern formation method and...

Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Radiation sensitive composition or product or process of making

Reexamination Certificate

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C430S270100, C430S905000, C430S913000, C430S914000, C430S270150, C430S311000, C430S314000

Reexamination Certificate

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07622243

ABSTRACT:
The present invention is a photosensitive element including a support and a photosensitive resin composition layer composed of a photosensitive resin composition containing (A) a binder polymer, (B) a photopolymerizable compound, and (C) a photopolymerization initiator, wherein,the photosensitive resin composition contains a thioxanthone-based compound represented by the following general formula (I) as the component (C), andwhen the parts by weight of the thioxanthone-based compound relative to 100 parts by weight for the total weight of the component (A) and the component (B) is taken to be P, and the film thickness of the photosensitive resin composition layer is taken to be Q (μm), then R, which is the product of P and Q, satisfies the condition of the following formula (1). In the following general formula (I), R1to R8represent a hydrogen atom, halogen atom or hydrocarbon group.in-line-formulae description="In-line Formulae" end="lead"?25.5≦R≦79.0  (1)in-line-formulae description="In-line Formulae" end="tail"?[Chemical Formula I]

REFERENCES:
patent: 4298738 (1981-11-01), Lechtken et al.
patent: 4710523 (1987-12-01), Lechtken et al.
patent: 7148382 (2006-12-01), Wolf et al.
patent: 7230122 (2007-06-01), Liu et al.
patent: 2004/0204613 (2004-10-01), Wolf et al.
patent: 2005/0165141 (2005-07-01), Wolf et al.
patent: 1334301 (2002-02-01), None
patent: 1358281 (2002-07-01), None
patent: 01-159637 (1989-06-01), None
patent: 02-035454 (1990-02-01), None
patent: 02-062545 (1990-03-01), None
patent: 02-113251 (1990-04-01), None
patent: 02-161437 (1990-06-01), None
patent: 02-161441 (1990-06-01), None
patent: 07-248623 (1995-09-01), None
patent: 11-327137 (1999-11-01), None
patent: 2001-133968 (2001-05-01), None
patent: 2001-201851 (2001-07-01), None
patent: 2002-351086 (2002-12-01), None
patent: 2003-262956 (2003-09-01), None
machine translation of JP 2001-201851.
machine translation of JP 2001-133968.
A. Ishikawa, “Feature: Pattern Forming Technology for Realizing Next-Generation Printed Wiring Boards—Mask-less Exposure for Shorter Development Times/Optimization for Mass-Production”,Electronics Mounting Technology, Ball Semiconductor Incorporated, pp. 74-79, Jun. 2002 Edition (vol. 18, No. 6).
Chinese Official Action issued on Mar. 6, 2009, in Chinese Application No. 2004800275719.

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