Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Radiation sensitive composition or product or process of making
Reexamination Certificate
2006-07-18
2006-07-18
Lee, Sin (Department: 1752)
Radiation imagery chemistry: process, composition, or product th
Imaging affecting physical property of radiation sensitive...
Radiation sensitive composition or product or process of making
C430S281100, C430S285100, C430S325000, C430S311000, C430S313000, C430S314000, C430S315000, C430S319000
Reexamination Certificate
active
07078151
ABSTRACT:
A photosensitive element comprising a support film and a photosensitive resin layer formed on the support film is provided, wherein the support film is a multilayer support film comprising at least three layers; and wherein the photosensitive resin layer comprises a photosensitive resin composition comprising (A) a binder polymer, (B) a photopolymerizable compound having at least one polymerizable ethylenically unsaturated group within a molecule, and (C) a photopolymerization initiator. Also provided are a method of forming a resist pattern comprising the steps of laminating such a photosensitive element onto a circuit-forming substrate such that the photosensitive resin layer comes into close contact therewith; forming an exposure part by irradiating a predetermined part of the photosensitive resin layer with an active light beam; and then eliminating a part other than the exposure part; and a method of making a printed circuit board comprising the step of etching or plating the circuit-forming substrate formed with a resist pattern by this method of forming a resist pattern.
REFERENCES:
patent: 4629680 (1986-12-01), Iwasaki et al.
patent: 63-200155 (1988-08-01), None
patent: 04-248843 (1992-09-01), None
patent: 06-287288 (1994-10-01), None
patent: 8-87106 (1996-04-01), None
patent: 09-211851 (1997-08-01), None
patent: 2982311 (1999-09-01), None
patent: 2000-214583 (2000-08-01), None
patent: 2001-005178 (2001-01-01), None
DERWENT abstract for JP 2000-214583 (Ishikawa et al).
Machine-Assisted English translation for the claims of JP 2000-214583 (Ishikawa et al) provided by JPO.
DERWENT abstract for JP 8-87106 (Tanizaki et al).
JPO abstract for JP 8-87106 (Tanizaki et al). DERWENT abstract for JP 63-200155 (Takeuchi et al).
English translation of JP 2000-214583 (Ishikawa et al), provided by PTO.
English translation of JP 63-200155(Takeuchi et al), provided by PTO.
Machine-assisted English translation of JP 06-287288 (Oosaki et al), provided by JPO.
English translation of JP 8-87106 (Tanizaki et al), provided by PTO.
Copy of Notice of Rejection, dispatched Jun. 29, 2005, from the Korean Patent Office regarding Korean Patent Application No. 10-2003-7003987, 3 pages.
Machine English translation of Japanese Patent 2,982,311, obtained from www4.ipdl.ncipi.go.jp on Sep. 26, 2005, 20 pages.
Aoki Tomoaki
Ichikawa Tatsuya
Kawaguchi Taku
Griffin & Szipl, P.C.
Hitachi Chemical Co. Ltd.
Lee Sin
LandOfFree
Photosensitive element, method for forming resist pattern,... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Photosensitive element, method for forming resist pattern,..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Photosensitive element, method for forming resist pattern,... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3578275