Photosensitive compound and photoresist composition...

Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Radiation sensitive composition or product or process of making

Reexamination Certificate

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C430S325000, C430S326000, C430S330000, C430S914000, C560S055000, C560S056000, C560S057000, C560S059000, C560S061000, C560S064000, C560S073000, C560S116000, C560S118000, C560S119000, C560S127000, C560S129000, C560S130000, C560S138000, C560S139000, C560S140000, C560S141000, C560S144000, C560S146000, C560S174000, C560S176000, C560S190000, C560S193000, C560S194000, C560S198000, C560S201000, C568S593000, C568S633000, C568S640000, C568S644000, C549S415000

Reexamination Certificate

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08043789

ABSTRACT:
A photosensitive compound whose size is smaller than conventional polymer for photoresist, and which has well-defined (uniform) structure, and a photoresist composition including the same are disclosed. The photosensitive compound represented by the following formula. Also, the present invention provides a photoresist composition comprising 1 to 85 wt % (weight %) of the photosensitive compound; 0.05 to 15 weight parts of a photo-acid generator with respect to 100 weight parts of the photosensitive compound; and 10 to 5000 weight parts of an organic solvent.In the formula, n is 0 or 1, x is 1, 2, 3, 4 or 5, y is 2, 3, 4, 5 or 6, z is 0, 1, 2, 3 or 4, R, R′ and R″ are independently hydrocarbon group of 1 to 30 carbon atoms, preferably 2 to 20 carbon atoms, and R′″ is a hydrogen atom or hydrocarbon group of 1 to 30 carbon atoms, preferably 2 to 20 carbon atoms.

REFERENCES:
patent: 6200729 (2001-03-01), Aoai et al.
patent: 2007-119370 (2007-05-01), None
Derwent English abstract for JP2007-119370.
Machine-assisted English translation of JP2007-119370.

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