Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Radiation sensitive composition or product or process of making
Reexamination Certificate
2011-05-24
2011-05-24
Lee, Sin J. (Department: 1722)
Radiation imagery chemistry: process, composition, or product th
Imaging affecting physical property of radiation sensitive...
Radiation sensitive composition or product or process of making
C430S325000, C430S326000, C430S330000, C430S914000, C568S643000, C560S141000, C560S146000
Reexamination Certificate
active
07947423
ABSTRACT:
A photosensitive compound whose size is smaller than conventional polymer for photoresist, and which has well-defined (uniform) structure, and a photoresist composition including the same are disclosed. The photosensitive compound represented by the following formula 1. Also, the photoresist composition comprises 1 to 85 wt % (weight %) of the photosensitive compound; 0.05 to 15 weight parts of a photo-acid generator with respect to 100 weight parts of the photosensitive compound; and 200 to 5000 weight parts of an organic solvent. In the formula 1, x is 1, 2, 3, 4 or 5, y is 2, 3, 4, 5 or 6, and R and R′ are independently a chain type or a ring type of aliphatic or aromatic hydrocarbon group of 1 to 30 carbon atoms.
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patent: 6416928 (2002-07-01), Ohsawa et al.
patent: 2006/0194144 (2006-08-01), Sooriyakumaran et al.
Kadota et al (“Creation of Low Molecular-weight Organic Resists for Nanometer Lithography”, Proceedings of SPIE—The International Society for Optical Engineering (2001), vol. 4345, p. 891-902).
Morikawa et al (“Preparation of Poly(ether ether ketone) Dendrimers by the Divergent Method”, Polymer Journal, vol. 32(3), p. 234-242 (2000)).
Kim Jae-hyun
Lee Jae-Woo
Lee Jun-Gyeong
Lim Young-Bae
Yoo Min-Ja
Birch & Stewart Kolasch & Birch, LLP
Dongjin Semichem Co., Ltd.
Lee Sin J.
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