Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Radiation sensitive composition or product or process of making
Patent
1994-09-12
1996-03-26
Berman, Susan W.
Radiation imagery chemistry: process, composition, or product th
Imaging affecting physical property of radiation sensitive...
Radiation sensitive composition or product or process of making
4302811, 430910, 522 84, 522 85, C08F 250, G03C 173, G03F 7033
Patent
active
055019420
ABSTRACT:
There are disclosed photosensitive compositions based on water as solvent and/or dispersant for the components of said compositions, comprising 10-50% by weight of water-soluble and/or water-dispersible solid, crosslinkable film-forming polymers as binder, 4-50% by weight of water-soluble and/or water-dispersible photopolymerisable acrylate and/or methacrylate monomers and/or corresponding oligomers, 0.1 to 10% by weight of water-soluble and/or water-dispersible photoinitiator compounds for the photopolymerisable acrylate and/or methacrylate monomers and/or corresponding oligomers, and if the binder contains non-selfcrosslinking polymers, 2.5-40% by weight of water-soluble and/or water-dispersible crosslinking agents for the polymeric binder as thermal hardener, selected from the group consisting of epoxy resins, melamine resins and blocked polyisocyanates.
Preferred compositions contain carboxyl group-containing acrylate and methacrylate polymers and copolymers as binder, the carboxyl groups of which composition are reacted with ammonia and/or amines in an amount sufficient to ensure the water-solubility of the polymers and copolymers.
The novel compositions are photoimageable and are particularly suitable for use as solder resists.
REFERENCES:
patent: 4592816 (1986-06-01), Emmons et al.
patent: 4621043 (1986-11-01), Gervay
patent: 4705740 (1987-11-01), Geissler et al.
patent: 4950580 (1990-08-01), Hilger
patent: 5045435 (1991-09-01), Adams et al.
patent: 5153101 (1992-10-01), Meier et al.
Materials Research Labs. Bull. Res. Dev., vol. 2 No. 2 (1988) pp. 13-17, Yeong-Cherng Chiou and Jonq-Min Liu: Emulsified Photoresist for Printed Circuit Imaging.
Salvin Roger P.
Schulthess Adrian
Berman Susan W.
Ciba-Geigy Corporation
Teoli, Jr. William A.
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