Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Radiation sensitive composition or product or process of making
Reexamination Certificate
2001-05-30
2002-08-13
Hamilton, Cynthia (Department: 1752)
Radiation imagery chemistry: process, composition, or product th
Imaging affecting physical property of radiation sensitive...
Radiation sensitive composition or product or process of making
C430S283100, C522S100000, C522S101000, C522S102000, C522S103000
Reexamination Certificate
active
06432613
ABSTRACT:
BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to a photosensitive composition, and more particularly to a photosensitive composition having a high resistance to heat, mainly for use in packaged circuit boards, such as P-BGA, T-BGA and F-CSP.
2. Description of the Prior Art
Circuit boards are widely used in electronic industries and the production of various kinds of electronic products. Current market trends in the electronics industry focus on decreased size and weight of circuit boards while increasing speed, capability and interconnection density. Recently there has been focus on the techniques used to manufacture high-density integrated circuit boards, for example: MCM-L, plastic ball grid array packaging(PBGA), flip-chip, and chip scale packaging.
With PBGA, for example, after a die is attached to a PBGA substrate, a series of steps, such as wiring, molding, soldering and reflowing are carried out. During the above process, local or external temperatures can reach 200° C., or even 300° C., thus the substrate material must be a resin having high glass transition temperature (Tg), a low heat swelling coefficient, low moisture absorbency, low dielectric properties, and high reliability. The photosensitive solder resist used in the substrate material must be highly adhesive, insulating, resistant to solder temperature, solvent-resistant, corrosion-resistant, plating-resistant, and singularly resistant to heat, pressure cooker, and thermal cycle tests.
Examples of conventional photosensitive solder resist material are disclosed in U.S. Pat. Nos. 5,100,767 and 4,943,516, wherein coating polymers containing carboxylic groups and multiple alkene unsaturated bonds, photosensitive monomers, photoinitiators and epoxy resins are subsequently photo-cured, developed with alkali water and heat-cured to be used in conventional printed circuit boards.
Moreover, U.S. Pat. No. 5,041,519 discloses that a modified PI resin has a high workability, a high rigidity, and good compatibility with epoxy resin. It is also highly resistant to heat and has a high glass transition temperature. In addition, U.S. Pat. No. 4,886,842 discloses that by adding bismaleimide in a photosensitive material containing epoxy resin and acrylic monomers, significant improvement in the reliability of TCT is observed. However, it is mainly used as adhesive clay for electronics devices and is a fully disposed type of resin. Hence, it cannot be developed to form images.
SUMMARY OF THE INVENTION
To overcome these problems, the invention provides a photosensitive composition having enhanced heat resistance that can be used in manufacturing MCM-L, plastic ball grid array packaging, flip-chip, and chip scale packaging. The photosensitive composition comprises:
(a) a prepolymer, containing a carboxyl group and an unsaturated vinyl group;
(b) a photoinitiator;
(c) an unsaturated photomonomer; and
(d) adduct of reacting bismaleimide derivative, a barbituric acid derivative, and an epoxy.
The above photosensitive composition undergoes processes, such as coating, drying, disposing, developing etc. to form patterns of photosensitive material on printed circuit boards.
The photosensitive composition with high resistance to heat of the invention has high adhesion with PI substrates. As well, it can be developed with alkali solutions. Having met the requirements of a highly heat-resistant solder resist material, the photosensitive composition of the invention can be used in package substrates, such as P-BGA, T-BGA, F-CSP. It also can be used as a photosensitive insulation layer.
DETAILED DESCRIPTION OF THE INVENTION
The following will further explain the photosensitive composition of the invention.
The photosensitive composition of the invention is comprised of a prepolymer containing a carboxyl group and an unsaturated vinyl group; photoinitiator; unsaturated photomonomer; and the reaction adduct of bismaleimide derivative, barbituric derivative and epoxy compound. Suitable solvents can be added as diluents.
The above prepolymer is selected from the group consisting of complete esterification products formed by the esterification of a novolak type epoxy compound with an unsaturated monocarboxylic acid; reaction products obtained by causing the secondary hydroxyl group of the esterification product resulting from said esterification to react with a saturated or unsaturated polybasic acid anhydride.
As the novolak type epoxy compounds described above, those which are obtained by the reaction of epichlorohydrin and/or methyl epichlorohydrin with novolaks resulting from the reaction of such phenols as phenol, cresol, halogenated phenol, and alkylphenol with formaldehyde in the presence of an acidic catalysts are particularly suitable. Examples of such suitable novolak type epoxy compounds are as follows: “Epo Tohto” YDCN-701, YDCN-704, YDPN-638 and YDPN-602 available from Tohto Kasei Company Ltd.; “D.E.N”-431 and -439 available from The Dow Chemical Company; “ARALDITE” EPN-1138, -1235, and -1299 available from Ciba-Geigy Ltd.; “EPICLON” N-730, -770, -865, -665, -673 and -695, and “PLYOPHEN” VH-4150, -4240, and -4440 available from Dainippon Ink and Chemicals Inc.; “EOCN” -120 and -104 , and “BRRN”-1020 available from Nippon Kayaku Company Ltd.; and “AER” ECN-265, -293, -285, and -299 available from Asahi Chemical Industry Company Ltd.. Optionally, the novolak type epoxy compounds may be partially or completely substituted with bisphenol A type, bisphenol F type, hydrogenated bisphenol A type, brominated bisphenol A type, amino group-containing, alicyclic, or polybutadiene modified glycidyl ether epoxy compounds, such as “EPIKOTE” -828, -1007 and -807 available from Yuka Shell Epoxy Kabushiki Company; “EPICLON” -840, -860, -3050, and -830 available from Dainippon Ink and Chemicals Inc; “D.E.R.” -330, -337 and -361 available from The Dow Chemical Company; “Celloxide” 2021 and 3000 available from Daicel Chemical Industries Ltd.; “TETRAD”-X and -C available from Mitsubishi Gas Chemical Company Inc.; “NISSO EPOXYN” EPB-13 and -27 available from Nippon Soda Company Ltd.; “Epo Tohto” YD-116, -128, -013, and -020, YDG-414, YDF-190, -2004, and -2007 available from Tohto Kasei Company Ltd.; ST-3000 and -110 available from Sun Tohto; “ARALDITE” GY-260, -255, XB-2615 available from Ciba Geigy Ltd.; “D.E.R” -332, -662 and -542 available from Dow Chemical Company. Among these, the cresol novolak type epoxy compounds are particularly desirable.
The unsaturated monocarboxylic acids used are, for example, acrylic acid, methacrylic acid, beta-styryl acrylic acid, beta-furfuryl acrylic acid, crotonic acid, alpha-cyanocinnamic acid, cinnamic acid, half esters of saturated or unsaturated dibasic acid anhydrides with (meth)acrylates possessing one hydroxyl group in the molecular unit thereof, such as, for example, half esters obtained by causing such saturated or unsaturated dibasic acid anhydrides of phthalic acid, tetrahydrophthalic acid, hexahydrophthalic acid, maleic acid, succinic acid, itaconic acid, chlorendic acid,methylhexahydrophthalic acid, methylendomethylene tetrahydrophthalic acid, and methyltetrahydrophthalic acid to react in equimolar ratio with hydroxyethyl acrylate, hydroxypropyl acrylate, hydroxybutyl acrylate, polyethylene glycol monoacrylate, glycerin diacrylate, trimethylol propane diacrylate, pentaerythritol triacrylate, dipentaerythritol pentacrylate and diacrylate of triglycidyl isocyanurate or with methacrylates corresponding to the acrylate enurerated above, and half esters of saturated or unsaturated dibasic acid anhydrides with unsaturated monoglycidyl compounds obtained by causing the saturated or unsaturated dibasic acids mentioned above to react similarly with glycidyl (meth)acrylate by the conventional method. These are used either singly or in a mixture of two or more constituents. Among other unsaturated monocarboxylic acids mentioned above, acrylic acid is preferable.
The saturated or unsaturated polybasic acid anhydrides described above may be, for example, the anhydrides of phthalic
Chen Man-Lin
Lin Hsien-Kuang
Liu Shur-Fen
Pan Jing-Pin
Hamilton Cynthia
Industrial Technology Research Institute
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