Photosemiconductor device and epoxy resin composition for use in

Details Photosemiconductor device and epoxy resin composition for use in Photosemiconductor device and epoxy resin composition for use in

1990-07-17

1992-04-21

Hille, Rolf

Electricity: conductors and insulators

Feedthrough or bushing

Compression

357 70, 174 522, 525 31, 525481, H01L 2328, H01L 2348, H01L 2944, H01L 2952

Patent

active

051073277

ABSTRACT:
A photosemiconductor device and an epoxy resin composition for use in molding a photosemiconductor used for the photosemiconductor device, the photosemiconductor device comprises a photosemiconductor element molded with a cured transparent epoxy resin composition, the cured transparent epoxy resin composition having a refractive index distribution curve characterized by the following (A), (B), and (C):

REFERENCES:
patent: 4327369 (1982-04-01), Kaplan
patent: 4663190 (1987-05-01), Fujita et al.
patent: 4703338 (1987-10-01), Sagami et al.
patent: 4926239 (1990-05-01), Fujita et al.
Database WPIL, No. 88-115956, Derwent Publications Ltd. London, GB & JP-A-63062363 (Nitto Electric Ind. K.K.).
Database WPI, No. 80-80854C, Derwent Publications Ltd., London GB, & DD-A-143839 (VEB Pentacon Dresden).
Patent Abstracts of Japan, vol. 10, No. 137 (E-405)(2194) May 21, 1986, & JP-A-61 001068 (Mitsubishi Denki K.K.) Jan. 7, 1986.

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