Photoresists suitable for forming relief structures of highly he

Details Photoresists suitable for forming relief structures of highly he Photoresists suitable for forming relief structures of highly he

1983-09-13

1985-09-10

Kittle, John E.

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Radiation sensitive composition or product or process of making

430283, 430287, 430288, 430326, 430330, 430 18, 20415915, 525421, 525426, G03C 170, G03C 516, C08G 6948

Patent

active

045406502

ABSTRACT:
Photoresists suitable for use for forming relief structures of highly heat-resistant polymers and which contain soluble polymeric precursors which carry radiation-reactive radicals bonded through carboxylic ester groups have an increased light-sensitivity when they also contain at least one radiation-reactive, polymerizable allyl compound which has a boiling point above 180.degree., the allyl group thereof being bonded via an oxygen, sulfur and/or nitrogen atom. The highly heat-resistant polymers which can be prepared by means of these photoresists have excellent chemical, electrical and mechanical properties.

REFERENCES:
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patent: 3825430 (1974-07-01), Kurka
patent: 3843572 (1974-10-01), Morgan
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patent: 4045223 (1977-08-01), Rubner et al.
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patent: 4291142 (1981-09-01), Tamura et al.
patent: 4310641 (1982-01-01), Ohmura et al.
patent: 4329419 (1982-05-01), Goff et al.
Gessner G. Hawley, Ed., "Polyamide" in The Condensed Chemical Dictionary, 10th Ed., Van Nostrand Reinhold Company Inc., New York, New York, 1981, p. 828.

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