Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Radiation sensitive composition or product or process of making
Patent
1988-06-28
1990-11-06
Dees, Jose G.
Radiation imagery chemistry: process, composition, or product th
Imaging affecting physical property of radiation sensitive...
Radiation sensitive composition or product or process of making
430191, 430197, 430177, 430271, 430273, 430280, 430281, 430935, G03F 7004
Patent
active
049685821
ABSTRACT:
The invention is a modified organic photoresist which is resistant to etching in oxygen-containing plasmas and therefore particularly useful for masking and etching organic polymer materials in VLSI and advanced packaging applications. The invention comprises adding a phosphorous-containing compound to a conventional photoresist. The phosphorous-containing compound is of a type and in an amount effective to substantially prevent etching of the modified photoresist in an oxygen-containing plasma without substantially adversely affecting the photosensitivity of the photoresist or the elasticity or the adhesion of the etch resistant film formed during oxygen-containing plasma exposure to an underlying material to be patterned and etched.
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Bobbio Stephen M.
DuBois Thomas D.
Frieser Rudolf G.
Jones Susan K. S.
Tranjan Farid M.
Dees Jos,e G.
MCNC and University of NC at Charlotte
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