Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1985-04-15
1987-11-10
Bashore, S. Leon
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
156644, 1566591, 156668, 156646, 430328, 430330, B44C 122, H01L 21312
Patent
active
047055979
ABSTRACT:
Photoresist apertures having tapered sidewalls can be provided by first opening the aperture in accordance with ordinary practice followed by the exposure of the photoresist to a suitable energy source such as a flood exposure to wideband light, the heating of the photoresist to round the peripheral edges of the aperture and the exposure of the thus pretreated photoresist to an environment which removes photoresist from the inside wall of the aperture until the desired tapered profile is obtained. In the preferred practice of the invention, the pretreated photoresist is removed from the inside wall of the aperture through exposure to a dry oxygen plasma etch.
REFERENCES:
patent: 4187331 (1980-02-01), Ma
patent: 4326936 (1982-04-01), Jones
patent: 4369090 (1983-01-01), Wilson et al.
patent: 4436584 (1984-03-01), Bernacki et al.
patent: 4484979 (1984-11-01), Stocker
Gimpelson George E.
Holbrook Cheryl L.
Rivoli Anthony L.
Anderson Andrew J.
Bashore S. Leon
Harris Corporation
Krawczyk Charles C.
Troner William A.
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