Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1987-01-09
1988-01-12
Powell, William A.
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
156635, 156646, 156655, 156668, 156345, 134 1, 427 541, B44C 122, C03C 1500, C03C 2506, B29C 3700
Patent
active
047189746
ABSTRACT:
Apparatus and method for removing organic polymers, such as photoresist, from the surface of an object, such as a semiconductor wafer. The apparatus comprises a microwave energy source and a reaction chamber housing an ultraviolet lamp and a platform for holding a semiconductor wafer. A portion of the chamber's exterior, between the ultraviolet lamp and the microwave energy source, is permeable to microwaves. The reaction chamber has an inlet and an outlet for passing a reaction gas through the reaction chamber. The platform is situated so that the full surface of a semiconductor wafer thereon is exposed to light emitted by the ultrtaviolet lamp which responds to microwave stimulation from the microwave energy source by emitting ultraviolet radiation having a preselected wavelength between 100 and 300 angstroms. Photoresist can be stripped from a semiconductor wafer on the platform by energizing the ultraviolet lamp while passing a reaction gas through the reaction chamber and thereby ablating organic polymers and impurities from the surface of the semiconductor wafer.
REFERENCES:
patent: 4414059 (1983-11-01), Blum et al.
patent: 4417948 (1983-11-01), Mayne-Banton et al.
patent: 4512868 (1985-04-01), Fijimura et al.
patent: 4673456 (1987-06-01), Spencer et al.
Powell William A.
Ultraphase Equipment, Inc.
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