Cleaning and liquid contact with solids – Processes – Gas or vapor condensation or absorption on work
Reexamination Certificate
2005-06-28
2005-06-28
Kornakov, M. (Department: 1746)
Cleaning and liquid contact with solids
Processes
Gas or vapor condensation or absorption on work
C134S002000, C134S025100, C134S025400, C134S034000, C134S037000, C134S102200, C438S906000
Reexamination Certificate
active
06911097
ABSTRACT:
Provided is a process and apparatus characterized by a gas distribution plate in which a gas supply manifold directs gas bubbles from the bottom of a process tank upward and between wafers contained in a cassette and supported therewithin. This improved method and apparatus is used for effectively stripping photoresist from the larger semiconductor wafers having dense top conductive patterns with protuberant sidewalls. The method provides a scrubbing action that is parallel to the device array being formed on the wafer's surface. Broadly stated, the method of a chemical action on large substrates supported adjacent respective edge portions thereof in a carrier includes submerging the carrier and substrates supported thereby in a process tank containing a liquid chemical, and a gas distribution plate disposed on the bottom of the tank for directing gas bubbles upward and parallel to the surfaces of each substrate contained in the carrier to ensure that a uniform chemical action occurs.
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Merriam-Webster's Collegiate Dictionary, Tenth edition, 1999. p. 223.
Chen Chie-Chi
Fang Jen-Shiang
Pan Sheng-Liang
Tseng Wen-Hsiang
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