Photoresist stripper composition and method of use

Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Removal of imaged layers

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134 38, 252153, 252162, 252170, 252172, 430260, 430331, B08B 308, C11D 750, C23G 502

Patent

active

044839170

ABSTRACT:
An improved process for removing crosslinked photoresist polymer from printed circuit boards which comprises contacting the printed circuit board with methylene chloride containing from about 5 to about 10 volume percent of a mixture of methanol and methyl formate. Each additive must be present at a minimum concentration of one volume percent. Stabilizers for the methylene chloride, such as epoxides, may be present at amounts no greater than about 0.5 volume percent.

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