Photoresist strip method for low-k dielectrics

Details Photoresist strip method for low-k dielectrics Photoresist strip method for low-k dielectrics

2009-07-31

2011-11-15

Estrada, Michelle (Department: 2829)

Semiconductor device manufacturing: process

Chemical etching

Vapor phase etching

C438S711000, C438S725000, C257SE21218, C257SE21311

Reexamination Certificate

active

08058178

ABSTRACT:
The present invention pertains to methods for removing unwanted material from a semiconductor wafer during wafer manufacturing. More specifically, the invention pertains to stripping photo-resist material and removing etch-related residues from a semiconductor wafer. Methods involve implementing a plasma operation using hydrogen and a weak oxidizing agent, such as carbon dioxide. The invention is effective at stripping photo-resist and removing residues from low-k dielectric material used in Damascene devices.

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