Photoresist resin composition, method of forming a...

Radiation imagery chemistry: process – composition – or product th – Diazo reproduction – process – composition – or product – Composition or product which contains radiation sensitive...

Reexamination Certificate

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C430S192000, C430S193000, C430S314000, C430S318000, C430S326000, C430S330000

Reexamination Certificate

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11550897

ABSTRACT:
A photoresist resin composition comprises about 10 to about 35% by weight of an acryl-based copolymer, about 5 to about 10% by weight of a quinone diazide compound, about 55 to about 80% by weight of a solvent, and about 0.01 to about 0.5% by weight of a silane-based surfactant where the weights of each of the acryl-based copolymer, quinone diazide compound, solvent, and silane-based surfactant are based on the total weight of acryl-based copolymer, quinone diazide compound, solvent, and silane-based surfactant. An overcoating layer formed using the photoresist resin composition has improved flatness, and thus defects on a display screen may be prevented and/or reduced.

REFERENCES:
patent: 4906458 (1990-03-01), Shigeta et al.
patent: 6841330 (2005-01-01), Miyake et al.
patent: 2004/0144753 (2004-07-01), Kang et al.
patent: 2005/0089790 (2005-04-01), Lee et al.

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