Photoresist resin composition

Details Photoresist resin composition Photoresist resin composition

2008-05-27

2008-05-27

Lee, Sin (Department: 1795)

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Radiation sensitive composition or product or process of making

C430S271100, C430S273100, C430S311000, C430S325000, C430S916000, C430S920000, C430S923000, C430S922000, C430S924000

Reexamination Certificate

active

11124224

ABSTRACT:
The invention provides photoresist resin compositions and in particular, a photoresist resin compositions comprising a) an acrylate monomer having two urethane bonds, b) a crosslinkable urethane monomer having at least two ethylene double bonds, c) an alkali-soluble compound, d) a photopolymerization initiator and e) a solvent, and a photoresist dry film resists using the photoresist resins. The photoresist resin compositions and the photoresist dry film resists using the same in accordance with the invention have excellent adhesion to a substrate and sandblast resistance and at the same time, they have high sensitivity as well as high resolution, thereby enabling fine pattern formation on substrates.

REFERENCES:
patent: 4458007 (1984-07-01), Geissler et al.

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