Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Radiation sensitive composition or product or process of making
Reexamination Certificate
2006-04-25
2006-04-25
Chu, John S. (Department: 1752)
Radiation imagery chemistry: process, composition, or product th
Imaging affecting physical property of radiation sensitive...
Radiation sensitive composition or product or process of making
C430S311000, C430S326000, C430S905000, C430S910000
Reexamination Certificate
active
07033726
ABSTRACT:
A polymeric compound for photoresist of the present invention includes a monomer unit having 2,6-dioxabicyclo[3.3.0]octane skeleton in the structure. The monomer unit having 2,6-dioxabicyclo[3.3.0]octane skeleton includes a monomer unit represented by the following Formula (I):wherein R is a hydrogen atom or a methyl group. The polymeric compound for photoresist may include a monomer unit having 2,6-dioxabicyclo[3.3.0]octane skeleton, a monomer unit having a group of adhesion to substrate, and a monomer unit having an acid-eliminating group. The polymeric compound for photoresist of the present invention exhibits not only adhesion to substrate, acid-eliminating property and resistance to dry-etching but also has well-balanced solubility in solvents for photoresist and alkali-soluble property.
REFERENCES:
patent: 4065488 (1977-12-01), Chou et al.
patent: 4252886 (1981-02-01), Himics et al.
patent: 4293475 (1981-10-01), Sidi
patent: 4297286 (1981-10-01), Sandrock et al.
patent: 5910286 (1999-06-01), Lipskier
patent: 2004/0232383 (2004-11-01), Imamoto et al.
patent: 9-73173 (1997-03-01), None
patent: 2000-26446 (2000-01-01), None
patent: 2001-302728 (2001-10-01), None
patent: 2001-323125 (2001-11-01), None
patent: 2002-311590 (2002-10-01), None
patent: 20044240387 (2004-08-01), None
patent: 2004333925 (2004-11-01), None
patent: 2004341062 (2004-12-01), None
patent: 20044341061 (2004-12-01), None
Koyama Hiroshi
Nishimura Masamichi
Tsutsumi Kiyoharu
Birch & Stewart Kolasch & Birch, LLP
Chu John S.
Daicel Chemical Industries Ltd.
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