Semiconductor device manufacturing: process – Masking
Reexamination Certificate
2006-03-14
2006-03-14
Nelms, David (Department: 2818)
Semiconductor device manufacturing: process
Masking
C438S014000
Reexamination Certificate
active
07012031
ABSTRACT:
A photoresist pattern and a method of fabricating the same make it easy to quickly identify a particular portion of a photolithography process that is responsible for causing process defects. The method of fabricating the photoresist pattern includes forming main patterns having a predetermined critical dimension in device-forming regions of a semiconductor substrate, and forming a plurality of test patterns in scribe regions of the substrate. The scribe regions are defined alongside the device-forming regions and separate the device-forming regions from one another. The test patterns have shapes similar to that of the main patterns. Also, one of the test patterns has a critical dimensions similar to that of the main patterns, and other test patterns have respective critical dimensions that are different from the critical dimension of the main patterns.
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Baek Kyoung-Yun
Choi Yeon-Dong
Nelms David
Nguyen Dao H.
Volentine Francos & Whitt PLLC
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