Photoresist exposure method and apparatus therefor

Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Making electrical device

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430311, 430394, 430397, G03C 500, G03C 504

Patent

active

050377221

ABSTRACT:
A photoresist exposure method in which a photoresist that is coated by electrodeposition on the surface of a printed circuit board having been subjected to through-hole plating and on the inner wall surfaces of through-holes therein is exposed to light through a film, comprises the first step of exposing the resist electro-deposited on the inner wall surfaces of the through-hole with a light source positioned adjacent to the board and rotated horizontally along the board surface, and the second step of exposing the resist on the board through a film for forming a precise pattern with a light source positioned remote from the board surface.

REFERENCES:
patent: 4883571 (1989-11-01), Kondo et al.

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