Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Radiation sensitive composition or product or process of making
Reexamination Certificate
2006-10-17
2006-10-17
Lee, Sin (Department: 1752)
Radiation imagery chemistry: process, composition, or product th
Imaging affecting physical property of radiation sensitive...
Radiation sensitive composition or product or process of making
C430S325000, C430S326000, C430S330000, C430S311000, C430S910000, C525S206000, C525S210000, C526S270000, C526S282000
Reexamination Certificate
active
07122291
ABSTRACT:
The present invention provides for a photoresist composition comprising a mixture of two different copolymers.
REFERENCES:
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patent: 2004/0161697 (2004-08-01), Kodama et al.
patent: 2005/0147915 (2005-07-01), Dammel
patent: 1296190 (2003-03-01), None
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patent: 2003-122007 (2003-04-01), None
English language abstract (from Japan Patent Office) of JP2003-122007.
Kamon et al., “Newly developed acrylic copolymers for ArF photoresist”, Proceedings of SPIE, vol. 4690, pp. 475-482 (2002).
Otake et al., “Design and Development of Novel Monomers and Copolymers for 193-nm Lithography”, J. Photopolymer Sci. and Tech., vol. 17, No. 4, pp. 475-482 (2004).
Otake et al., “Design and Development of Novel Monomers and Copolymers for 193-nm Lithography”, Microlithography, Feb. 23-24, 2004.
Invitation to Pay Additional Fees (Form PCT/ISA/206) for PCT/IB2005/002844.
Derwent Abstract of JP 2003-43690.
Machine-assisted English translation of JP 2003-43690, provided by JPO.
Copy of Communication (Form PCT/ISA/224) and of Written Opinion of the International Searching Authority (Form PCT/ISA/237) in corresponding PCT International Application No. PCT/IB2005/002844.
Hong Chi-Sun
Kudo Takanori
Lin Guanyang
Padmanaban Munirathna
Rahman M. Dalil
AZ Electronic Materials USA Corp.
Kass Alan P.
Lee Sin
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