Photoresist composition having a high heat resistance

Details Photoresist composition having a high heat resistance Photoresist composition having a high heat resistance

2006-12-05

2006-12-05

Chu, John S. (Department: 1752)

Radiation imagery chemistry: process, composition, or product th

Imaged product

Including resin or synthetic polymer

C430S189000, C430S191000, C430S192000, C430S280100

Reexamination Certificate

active

07144662

ABSTRACT:
The present invention relates to a photoresist composition having high heat resistance used in the production process of an LCD, and more particularly, to a photoresist composition having high heat resistance, capable of decreasing process tact (a way), of process simplification, and of the retrenchment of expenditures. The inventive composition facilitates this through making it possible to skip 5 processes, such as Cr metal deposition forming a metal film, and the photo/etch/PR strip/etch steps of the whole surface of the metal, by substituting the inventive composition for the usual metal film, such that N+ion doping in production of TFT-LCD can take place due its high heat resistance.

REFERENCES:
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patent: 5372912 (1994-12-01), Allen et al.
patent: 5492793 (1996-02-01), Breyta et al.
patent: 6420464 (2002-07-01), Kuboki et al.
patent: 6653043 (2003-11-01), Hanabata
patent: 2002/0055059 (2002-05-01), Nishimura et al.
patent: 2001-0085203 (2001-09-01), None

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