Semiconductor device manufacturing: process – Making device or circuit emissive of nonelectrical signal – Including integrally formed optical element
Reexamination Certificate
2011-04-19
2011-04-19
Lebentritt, Michael S (Department: 2829)
Semiconductor device manufacturing: process
Making device or circuit emissive of nonelectrical signal
Including integrally formed optical element
C438S694000, C257SE21223, C257SE21232, C257SE21257, C257SE21599, C257SE33074
Reexamination Certificate
active
07927897
ABSTRACT:
A photoresist composition includes a binder resin, a photo acid generator, an acryl resin having four different types of monomers, and a solvent.
REFERENCES:
patent: 5156731 (1992-10-01), Ogasawara et al.
patent: 7132213 (2006-11-01), Masuda et al.
patent: 7169532 (2007-01-01), Okui et al.
patent: 7208334 (2007-04-01), Asakawa et al.
patent: 7445881 (2008-11-01), Asakawa et al.
patent: 7514203 (2009-04-01), Moon et al.
patent: 7608381 (2009-10-01), Kinoshita et al.
patent: 7629035 (2009-12-01), Lee et al.
patent: 2006/0166131 (2006-07-01), Masuda et al.
patent: 2009/0258497 (2009-10-01), Park et al.
patent: 2001033951 (2001-02-01), None
patent: 2003342434 (2003-12-01), None
patent: 1020010040651 (2001-05-01), None
Choi Jae-Young
Kang Deok-Man
Lee Hi-Kuk
Lee Min-soo
Oh Sae-Tae
AZ Electronic Materials (Japan) K.K.
H.C. Park & Associates PLC
Lebentritt Michael S
Samsung Electronics Co,. Ltd.
LandOfFree
Photoresist composition and method of manufacturing array... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Photoresist composition and method of manufacturing array..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Photoresist composition and method of manufacturing array... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2662218