Photoresist composition and method of manufacturing a...

Radiation imagery chemistry: process – composition – or product th – Diazo reproduction – process – composition – or product – Composition or product which contains radiation sensitive...

Reexamination Certificate

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Details

C430S191000, C430S192000, C430S193000, C430S270100, C430S313000, C430S326000, C438S149000, C438S151000

Reexamination Certificate

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07638253

ABSTRACT:
In one example, a photoresist composition includes about 1 to about 70 parts by weight of a first binder resin including a repeat unit represented by the following Chemical Formula 1, about 1 to about 70 parts by weight of a second binder resin including a repeat unit represented by the following Chemical Formula 2, about 0.5 to about 10 parts by weight of a photo-acid generator, about 1 to about 20 parts by weight of a cross-linker and about 10 to about 200 parts by weight of a solvent. The photoresist composition may improve the heat resistance and adhesion ability of a photoresist pattern.wherein R1and R2independently represent an alkyl group having 1 to 5 carbon atoms, and n and m independently represent a natural number.

REFERENCES:
patent: 5216111 (1993-06-01), Zampini
patent: 5709977 (1998-01-01), Tan et al.
patent: 5723254 (1998-03-01), Zampini et al.
patent: 6511783 (2003-01-01), Uenishi
patent: 7291439 (2007-11-01), Park et al.
patent: 2007/0111412 (2007-05-01), Oh et al.
patent: 2005-507509 (2005-03-01), None
patent: 1999-0063688 (1999-07-01), None
patent: 2006-0005349 (2006-01-01), None
English Language Abstract, Publication No. JP 2005-507509, Mar. 17, 2005, 1 p.
English Language Abstract, Publication No. KR 1999-0063688, Jul. 26, 1999, 1 p.
English Language Abstract, Publication No. KR 2006-0005349, Jan. 17, 2006, 1 p.

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