Photoresist application over hydrophobic surfaces

Semiconductor device manufacturing: process – Coating of substrate containing semiconductor region or of... – Insulative material deposited upon semiconductive substrate

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C438S907000

Reexamination Certificate

active

10981880

ABSTRACT:
A method of forming a layer of photoresist28over a surface30of a semiconductor wafer10by forming a layer of pre-wet solvent52over the surface30and forming the layer of photoresist28over the layer of pre-wet solvent52. Also, a layer of photoresist28formed by this method.

REFERENCES:
patent: 5066616 (1991-11-01), Gordon
patent: 5150176 (1992-09-01), Schoenberg
patent: 5773083 (1998-06-01), Fischer et al.
patent: 5891749 (1999-04-01), Park
patent: 6099662 (2000-08-01), Wang et al.
patent: 6641986 (2003-11-01), Zhang et al.
patent: 6884462 (2005-04-01), Whitman
patent: 2004/0072450 (2004-04-01), Collins et al.
Ping Jiang, et al. “Plasma Treatment for Silicon-Based Dielectrics” U.S. Appl. No. 10/843,957, filed May 11, 2004.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Photoresist application over hydrophobic surfaces does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Photoresist application over hydrophobic surfaces, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Photoresist application over hydrophobic surfaces will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3787908

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.