Semiconductor device manufacturing: process – Coating of substrate containing semiconductor region or of... – Insulative material deposited upon semiconductive substrate
Reexamination Certificate
2007-01-02
2007-01-02
Dang, Phuc T. (Department: 2818)
Semiconductor device manufacturing: process
Coating of substrate containing semiconductor region or of...
Insulative material deposited upon semiconductive substrate
C438S907000
Reexamination Certificate
active
10981880
ABSTRACT:
A method of forming a layer of photoresist28over a surface30of a semiconductor wafer10by forming a layer of pre-wet solvent52over the surface30and forming the layer of photoresist28over the layer of pre-wet solvent52. Also, a layer of photoresist28formed by this method.
REFERENCES:
patent: 5066616 (1991-11-01), Gordon
patent: 5150176 (1992-09-01), Schoenberg
patent: 5773083 (1998-06-01), Fischer et al.
patent: 5891749 (1999-04-01), Park
patent: 6099662 (2000-08-01), Wang et al.
patent: 6641986 (2003-11-01), Zhang et al.
patent: 6884462 (2005-04-01), Whitman
patent: 2004/0072450 (2004-04-01), Collins et al.
Ping Jiang, et al. “Plasma Treatment for Silicon-Based Dielectrics” U.S. Appl. No. 10/843,957, filed May 11, 2004.
Andres Paul L.
Salinas Adrian
Brady W. James
Keagy Rose Alyssa
Telecky , Jr. Frederick J.
Texas Instruments Incorporated
LandOfFree
Photoresist application over hydrophobic surfaces does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Photoresist application over hydrophobic surfaces, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Photoresist application over hydrophobic surfaces will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3787908