Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Making electrical device
Patent
1983-09-23
1985-10-01
Kittle, John
Radiation imagery chemistry: process, composition, or product th
Imaging affecting physical property of radiation sensitive...
Making electrical device
430327, 430322, 430494, G03C 516
Patent
active
045446261
ABSTRACT:
By exposing a photopolymer layer to radiation under the surface of a liquid medium such as water that does not affect the photopolymer solubility characteristic, disproportionately faster exposure time with lower energy cost and heat dissipation giving longer life to equipment and phototools and reducing production costs. The water additionally synergetically reacts as a coolant dissipating heat and as a release agent permitting photo bearing images to be in direct contact with the photopolymer while being radiated without accumulation of unwanted photopolymer to scratch the image or decrease its resolution.
REFERENCES:
patent: 3573975 (1971-04-01), Dhaka et al.
patent: 3664738 (1972-05-01), Cameron
patent: 3723120 (1973-03-01), Hummel
patent: 3746541 (1973-07-01), Sharp
patent: 4148934 (1979-04-01), Baker
patent: 4201581 (1980-05-01), Thomas et al.
patent: 4346164 (1982-08-01), Tabarelli et al.
W. S. DeForest, Photoresist: Materials and Processes (McGraw-Hill Inc., New York, 1975), pp. 20-33.
W. M. Moreau, "Proximity Printing Photomask", IBM Technical Disclosure Bulletin, vol. 14, No. 9, Feb. 1972, p. 2556.
Brown Laurence R.
Hamilton Cynthia
Kittle John
LandOfFree
Photoprinting process and apparatus for exposing photopolymers does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Photoprinting process and apparatus for exposing photopolymers, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Photoprinting process and apparatus for exposing photopolymers will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1442474