Photopolymerizable radiation-sensitive resin composition and rad

Details Photopolymerizable radiation-sensitive resin composition and rad Photopolymerizable radiation-sensitive resin composition and rad

1981-04-24

1983-01-25

Brammer, Jack P.

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Radiation sensitive composition or product or process of making

430281, 430910, 430919, 20415915, G03C 178

Patent

active

043704034

DESCRIPTION:


DESCRIPTION
BEST MODE FOR CARRYING OUT THE INVENTION

The photopolymerizable radiation-sensitive resin compositions according to the present invention comprise polymers which are photopolymerizable and alkali-soluble. As the polymers of this type, for example, novolak type phenol-formaldehyde resins, copolymers of acrylic or methacrylic acid, alkyd resins having a high acid value, shellac-acrylic acid copolymers, styrene-maleic acid copolymeric resins and the like are well-known. Among these polymers, particular styrene-maleic acid copolymeric resins are selected and used in the present invention. The reason why the above particular polymers are used in the present invention is based on the following facts. Namely, while the styrene-maleic acid copolymeric resin is photopolymerized by actinic radiation in the presence of a photopolymerization initiator and, as a result of this, its inherent alkali-solubility is lost, the unpolymerized styrene-maleic acid copolymeric resin, when it has added thereto an unsaturated compound with a polymerizable ethylene bond, its alkali-solubility is increased greatly. Accordingly, the polymer having added thereto an unsaturated compound can be dissolved with alkali weaker than that used in dissolving the polymer, comprising only styrene-maleic acid copolymeric resin having no unsaturated compound added thereto, and the photopolymerization initiator. Although many similar experiments were repeated using other polymers, an alkali-solubility which was equivalent to or more than than of the above-mentioned styrene-maleic acid copolymeric resin could not be attained.
Styrene-maleic acid copolymeric resins which are copolymeric resins of styrene and maleic anhydride are widely used in many applications such as paints, sizing agents for textiles, aqueous printing inks and the like. These resins are commercially available, e.g., from Sinclair Petrochemicals, Inc. under the trade name: SMA Resin, from Monsanto Chemical Co. under the trade name: LYTRON Resin, and from Daido Industrial Co., Ltd. under the trade name: Stylite, respectively. The styrene-maleic acid copolymeric resins generally have a molecular weight of from 700 to 50,000. The molecular weight varies depending upon various factors such as amounts of monomers used in the production of the copolymeric resins, reaction period of time, degree of esterification and the like. Furthermore, the acid value of these copolymeric resins usually ranges from 130 to 500. The styrene-maleic acid copolymeric resins useful in embodying the present invention have a molecular weight of from 1,000 to 2,000 and an acid value of from 130 to 220. Styrene-maleic acid copolymeric resins, which are partially esterified styrene-maleic anhydride resins and contain carboxyl groups yet remaining in the molecule, are particularly preferred.
The following Table I illustrates the results which are obtained when the amount of an ethylenically unsaturated compound to be added to the styrene-maleic acid copolymeric resin is widely varied. It will be understood from this table that the alkali-solubility of the styrene-maleic acid copolymeric resin is more and more increased with the increase in the amount of the unsaturated compound added thereto. In the Table I below, all parts used herein are by weight, and alkali used herein is a 0.0005% solution of anhydrous sodium carbonate. The thickness of the dried coating is 10 microns.


TABLE I __________________________________________________________________________ Styrene-maleic Exposed and acid copolymeric Unsaturated Speed of Unexposed developed resin compound Initiator development coating coating __________________________________________________________________________ 94 parts 0 6 parts more than 180" hard, hard, non-tacky, non-tacky cracks when bent 80 parts 14 parts 6 parts 60"-90" hard, hard, non-tacky, non-tacky slightly poor solvent resistance 72 parts 22 parts 6 parts 35"-45" hard, hard, non-tacky, non-tacky good coating 64 parts

REFERENCES:
patent: 4113593 (1978-09-01), Barzynski et al.
patent: 4268667 (1981-05-01), Anderson
patent: 4289845 (1981-09-01), Boutle et al.
Kosar, "Light Sensitive Systems", 1965, pp. 160-167.

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