Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Radiation sensitive composition or product or process of making
Patent
1981-12-24
1983-11-08
Brammer, Jack P.
Radiation imagery chemistry: process, composition, or product th
Imaging affecting physical property of radiation sensitive...
Radiation sensitive composition or product or process of making
20415919, 20415918, 430285, 430288, G03C 168
Patent
active
044143125
ABSTRACT:
A polymeric heat resistant photopolymerizable composition of a polyamide ester resin containing photopolymerizable groups useful for forming relief structures on electrical devices such as capacitors, integrated circuits, printed circuits and semiconductors; a solution of the composition is applied to a substrate such as a coated silicon wafer which is the base for an electrical device, dried to form a film, the film is exposed to radiation through a pattern and photopolymerized; the unexposed and unpolymerized part of the film is dissolved off and the resulting relief structure is converted to a polyimide structure with sharp definition and has good mechanical, chemical and electrical properties; to reduce radiation exposure time and increase the rate of photopolymerization the following constituents are used in the composition:
radiation sensitive polymerizable polyfunctional acrylate compound and photopolymerization initiators containing hydrogen donor initiator and aromatic biimidazole, and an oxygen scavenger.
REFERENCES:
patent: 3380831 (1968-04-01), Cohen
patent: 3479185 (1969-11-01), Chambers
patent: 3552973 (1971-01-01), Fishman
patent: 3594410 (1971-07-01), Cohen
patent: 3623870 (1971-11-01), Curran
patent: 3784557 (1974-01-01), Cescon
patent: 3953877 (1976-04-01), Sigusch et al.
patent: 3957512 (1976-05-01), Kleeberg et al.
patent: 4040831 (1977-08-01), Rubner et al.
patent: 4093461 (1971-06-01), Loprest et al.
patent: 4117196 (1973-09-01), Mathias
patent: 4132812 (1979-01-01), Mathias
patent: 4188224 (1980-02-01), Felder et al.
patent: 4291115 (1981-09-01), Chambers
patent: 4329419 (1982-05-01), Goff et al.
Goff David L.
Proskow Stephen
Yuan Edward L.
Brammer Jack P.
E. I. Du Pont de Nemours & Co.
Fricke Hilmar L.
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