Photopolymerizable composition

Details Photopolymerizable composition Photopolymerizable composition

1997-01-28

1998-03-03

Hamilton, Cynthia

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Radiation sensitive composition or product or process of making

4302861, 4302871, 522121, G03F 7031, G03F 7038

Patent

active

057232610

ABSTRACT:
The present invention relates to a photopolymerizable composition; more specifically, the present invention relates to a photopolymerizable composition useful as photoimageable solder mask of one component type, which can form image by ultraviolet exposure and development in an aqueous solution of dilute alkali after film formation and which has excellent ultraviolet curability and heat resistance of solder. The composition contains a reaction product, a diluent and a sensitizer, the reaction product being produced by adding epoxy group-containing acrylic acid ester or epoxy group-containing methacrylic acid ester to a part of the carboxyl group of the copolymer of acrylic acid ester or methacrylic acid ester with acrylic acid or methacrylic acid.

REFERENCES:
patent: 3448089 (1969-06-01), Celeste
patent: 3980483 (1976-09-01), Nishikubo et al.
patent: 3989610 (1976-11-01), Tsukada et al.
patent: 4025348 (1977-05-01), Tsukada et al.
patent: 4806450 (1989-02-01), Hofmann et al.
patent: 4855215 (1989-08-01), Nakano et al.
patent: 4970135 (1990-11-01), Kushi et al.

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