Photolithography technique utilizing alignment marks at scribe l

Details Photolithography technique utilizing alignment marks at scribe l Photolithography technique utilizing alignment marks at scribe l

1999-07-07

2000-06-06

Young, Christopher G.

Radiation imagery chemistry: process, composition, or product th

Registration or layout process other than color proofing

G03F 900

Patent

active

060716568

ABSTRACT:
A photolithography technique. A chip has latitudinal scribe lines and longitudinal scribe lines and also has a plurality of alignment marks. The latitudinal scribe lines and longitudinal scribe lines divide the chip into a plurality of dies. Some dies are effective dies. Alignment marks are located at each intersection of the latitudinal and longitudinal scribe lines. Each shot contains a plurality of dies. A mask having a plurality of mask alignment marks is provided. The mask alignment marks are used for alignment with alignment marks in the chip. The alignment marks of the chip are aligned with the mask alignment marks of the mask. At least three alignment marks close to the effective dies in the shots are selected for detection a focus and focal plane of each shot, so as to level the shot and perform an exposure step on each shot, shot by shot.

REFERENCES:
patent: 5695897 (1997-12-01), Mitome et al.
patent: 5837404 (1998-11-01), Lu
patent: 5868560 (1999-02-01), Tamada et al.

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