Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Patent
1997-10-07
2000-09-05
Bowers, Charles
Semiconductor device manufacturing: process
Coating with electrically or thermally conductive material
To form ohmic contact to semiconductive material
438623, 438672, 438688, 438780, 438927, H01L 214763, H01L 2144, H01L 2131, H01L 21469
Patent
active
061142360
ABSTRACT:
A process for producing a semiconductor device having an interlayer insulating film of low dielectric constant and interconnects of low resistance and operable at a high speed, which comprises:
REFERENCES:
patent: 5429995 (1995-07-01), Nishiyama
patent: 5614439 (1997-03-01), Murooka
patent: 5641581 (1997-06-01), Nishiyama
patent: 5783483 (1998-07-01), Gardner
patent: 5837604 (1998-11-01), Jun
Extended abstract of the 1993 International Coference on Solid State Devices and Materials; Makuhari; 1993; pp. 180-182.
Berezny Nema
Bowers Charles
NEC Corporation
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