Photolithography method and photolithography system for performi

Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Making electrical device

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430396, G03F 720

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active

057472211

ABSTRACT:
A system and method for imaging a wafer in the producation of integrated circuits is disclosed. A plurality of reticles are used between a condenser lens and a projection lens to project integrated circuit mask pattern on a wafer. The transparent area of the mask patterns on the reticles, respectively, are different from each other in order to prevent the decrease of the resolution due to a change in the optical path while light passes through the reticles and the projection lens. Additionally, in at least one position between reticles, there is disposed at least one condenser lens to enhance both the straightness of light and the uniformity of exposure energy of the light.

REFERENCES:
patent: 3615466 (1971-10-01), Sahni
patent: 4702592 (1987-10-01), Geiger
patent: 5206515 (1993-04-01), Elliott et al.

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