Photoformed plated interconnection of embedded integrated circui

Details Photoformed plated interconnection of embedded integrated circui Photoformed plated interconnection of embedded integrated circui

1974-02-28

1976-06-22

Powell, Wiliam A.

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

96 351, 96 362, 156 3, 156 16, 156300, 264272, 427 44, 427 98, 427272, 427405, 427409, B05D 124, B05D 138

Patent

active

039652777

ABSTRACT:
A process for electrically interconnecting a group of integrated-circuit chips embedded in plastic is described. Multilayer conductors are plated in grooves photoformed in successively applied plastic layers and connected to the chip pads and to conductors on other layers through vias also photoformed in the plastic. Photoformation of wiring grooves and layer-interconnecting vias is accomplished by ultraviolet irradiation of photosensitized liquid polyester resin.

REFERENCES:
patent: 3481777 (1969-12-01), Spannhake
patent: 3649274 (1972-03-01), Older et al.
patent: 3679941 (1972-07-01), LaCombe

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