Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1984-06-14
1985-07-09
Powell, William A.
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
29572, 156646, 156652, 156656, 156667, 219121LJ, H01L 21306, B44C 122, C03C 1500, C23F 102
Patent
active
045280657
ABSTRACT:
A manufacturing method of a photoelectric conversion device which comprises a plurality n of semiconductor elements U.sub.1 to U.sub.n formed on a substrate side by side and connected in series one after another. On the substrate a first conductive layer is formed and then it is subjected to first laser beam scanning to form first groove G.sub.1, to G.sub.n-1 and electrodes E.sub.1, to E.sub.n respectively separated by the grooves G to G.sub.n-1. Next, on the substrate a non-single-crystal semiconductor laminate member is formed to cover the grooves G.sub.1 to G.sub.n-1 and the electrodes E.sub.1 to E.sub.n and then, the non-single-crystal semiconductor laminate member is subjected to second laser beam scanning to form grooves O.sub.1 to O.sub.n-1 respectively extending into the first electrodes E.sub.1 to E.sub.n-1 and laminate member Q.sub.1 to Q.sub.n. Next, a second conductive layer is formed to continuously extend on the laminate member Q.sub.1 Q.sub.n and extends into the grooves Q.sub.1 to Q.sub.n-1 and then, the second conductive layer is subjected to the third laser beam scanning to form isolating portion H.sub.1 to H.sub.n-1 and electrodes F.sub.1 to F.sub.n respectively connected to the electrodes E.sub.1 to E.sub.n-1 through the coupling portions K.sub.1 to K.sub.n-1.
REFERENCES:
patent: 4281208 (1981-07-01), Kuwano et al.
patent: 4315096 (1982-02-01), Tyan et al.
patent: 4325182 (1982-04-01), Tefft et al.
Powell William A.
Semiconductor Energy Laboratory Co,. Ltd.
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