Photocurable resin composition having excellent adhesion to the

Details Photocurable resin composition having excellent adhesion to the Photocurable resin composition having excellent adhesion to the

1986-06-06

1988-07-12

Martin, Roland E.

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Radiation sensitive composition or product or process of making

430954, 430920, 430922, 430277, 522121, 522102, G03C 194, G03C 168

Patent

active

047569948

ABSTRACT:
A photocurable composition comprising (a) 100 parts by weight of a resin having structural units derived from at least one alpha, beta-unsaturated ethylenically unsaturated monomer, (b) 10 to 300 parts by weight of a photopolymerizable monomer, (c) 0.1 to 20 parts by weight of a photopolymerization initiator, and (d) 0.01 to 1 part by weight of a compound represented by the following general formula (I) or general formula (II) ##STR1## wherein R.sup.1 represents a divalent aromatic hydrocarbon group having bonds at the ortho-position to each other; R.sup.2 represents hydrogen, an alkyl group having 1 to 4 carbon atoms, a phenyl group or an aryl group having a C.sub.1 -C.sub.4 alkyl; R.sup.3 and R.sup.4 each represent an alkyl group having 1 to 10 carbon atoms, an aryl group or an aralkyl group; X.sup.1 represents oxygen, sulfur or N--R.sup.5 ; X.sup.2 represents oxygen, sulfur or NH; X.sup.3 represents nitrogen or CR.sup.6 ; X.sup.4 represents oxygen, sulfur or NR.sup.6 ; X.sup.5 represents nitrogen or CR.sup.7 ; X.sup.6 represents nitrogen or CH; R.sup.5 represents hydrogen, a hydroxyl group, halogen or an alkyl group having 1 to 4 carbon atoms; R.sup.6 represents hydrogen or an alkyl group having 1 to 4 carbon atoms; and R.sup.7 represents hydrogen, NH.sub.2, halogen or an alkyl group having 1 to 4 carbon atoms.

REFERENCES:
patent: 3597343 (1971-08-01), Delzenne et al.
patent: 3622334 (1971-11-01), Hurley
patent: 3873316 (1975-03-01), Velten et al.
patent: 4629679 (1986-12-01), Uchida et al.

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