Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Radiation sensitive composition or product or process of making
Patent
1995-11-09
1998-06-23
Hamilton, Cynthia
Radiation imagery chemistry: process, composition, or product th
Imaging affecting physical property of radiation sensitive...
Radiation sensitive composition or product or process of making
4302851, 4302871, 4302831, 4302811, 522 84, G03F 7032, G03F 7038
Patent
active
057703477
ABSTRACT:
A photocurable and thermosetting coating composition which can be diluted with water is disclosed. This composition comprises a photopolymerizable resin having a number-average molecular weight in the range of from 500 to 50,000 and containing an aprotic ammonium salt-containing moiety in a proportion of from 0.2 to 4.0 mols per kilogram of the resin, a photopolymerization initiator, a thermosetting component, and a diluent. The photopolymerizable resin is obtained by the reaction of a polymer possessing a tertiary amino group with a monocarboxylic acid and a monoepoxy compound either or both thereof possessing a polymerizable unsaturated double bond. As the thermosetting component, at least one member selected from the group consisting of amino resins, cyclocarbonate compounds, blocked isocyanate compounds, and epoxy resins is used. A tack-free coating film is obtained by applying this composition to a printed circuit board and drying the applied layer of the composition. A delicate resist pattern can be formed by exposing the coating film to an actinic radiation and developing the unexposed areas of the coating film with water or a dilute aqueous acid solution. By thermally curing the patterned resist film, a solder resist film excelling in various properties expected of a solder resist is obtained.
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Fukushima Kazunobu
Ichikawa Kyo
Saitoh Teruo
Hamilton Cynthia
Kananen Ronald P.
Taiyo Ink Manufacturing Co., Ltd.
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