Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Reexamination Certificate
2005-07-19
2005-07-19
Haran, John T. (Department: 1733)
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
C156S275700, C156S330000
Reexamination Certificate
active
06918984
ABSTRACT:
The present invention is directed to a photocurable composition for use as an encapsulant, for underfill or attachment adhesives, capable of curing at wavelengths greater than 290 nm. Reaction products of these photocurable compositions have a low level of extractable halide ion, such as less than 100 ppm. In use, the photocurable composition may be applied, for instance, over the wire bonds that electrically connect a semiconductor device to a substrate to maintain a fixed positional relationship and protect the integrity of the electrical connection from vibrational and shock disturbances, as well as from interference from environmental contaminants.
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Cahill John E.
Holloway Matthew J.
Lakes Aisling
Ledwidge Eadaoin D.
Murray Helen M.
Bauman Steven C.
Haran John T.
Loctite (R&D) Limited
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