Photoacid-labile polymers and photoresists comprising same

Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Radiation sensitive composition or product or process of making

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C430S326000, C430S910000, C430S311000

Reexamination Certificate

active

07022455

ABSTRACT:
The present invention relates to new polymers that contain photoacid-labile groups that comprise arylalkyl groups. Particularly preferred are polymers having a benzylic carbon directly linked to an ester oxygen. Polymers of the invention are useful as a component of chemically-amplified positive-acting resists.

REFERENCES:
patent: 5071730 (1991-12-01), Allen et al.
patent: 5110709 (1992-05-01), Aoai et al.
patent: 5352564 (1994-10-01), Takeda et al.
patent: 5432039 (1995-07-01), Shimokawa et al.
patent: 5443690 (1995-08-01), Takechi et al.
patent: 5506088 (1996-04-01), Nozaki et al.
patent: 5558971 (1996-09-01), Urano et al.
patent: 5688628 (1997-11-01), Oie et al.
patent: 5786131 (1998-07-01), Allen et al.
patent: 5861231 (1999-01-01), Barclay et al.
patent: 5866304 (1999-02-01), Nakano et al.
patent: 6042997 (2000-03-01), Barclay et al.
patent: 6136501 (2000-10-01), Trefonas et al.
patent: RE37179 (2001-05-01), Yamachika et al.
patent: 6379861 (2002-04-01), Trefonas et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Photoacid-labile polymers and photoresists comprising same does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Photoacid-labile polymers and photoresists comprising same, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Photoacid-labile polymers and photoresists comprising same will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3553159

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.