Photo-curable resin composition comprising a polyimide, a...

Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Radiation sensitive composition or product or process of making

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C430S906000, C430S913000, C430S964000, C528S010000, C528S310000

Reexamination Certificate

active

07485405

ABSTRACT:
The present invention relates to a photocurable resin composition, wherein the composition comprises:(A) a polyimide resin having one or more primary alcoholic groups with an alcoholic equivalent equal to or less than 3500, said polyimide being soluble in an organic solvent and having a weight average molecular weight of from 5,000 to 500,000; (B) at least one selected from the group consisting of a condensate of an amino compound modified with formalin, optionally further with alcohol, preferably a melamine resin modified with formalin, optionally further with alcohol, and a urea resin with formalin, optionally further with alcohol, and a phenolic compound having, on average, at least two selected from the group consisting of a methylol group and an alkoxy methylol group, and (C) a photoacid generator capable of generating an acid upon irradiation with light of a wavelength of from 240 nm to 500 nm.

REFERENCES:
patent: 3953877 (1976-04-01), Sigusch et al.
patent: 4243743 (1981-01-01), Hiramoto et al.
patent: 4339521 (1982-07-01), Ahne et al.
patent: 6001534 (1999-12-01), Kato
patent: 6605353 (2003-08-01), Okada et al.
patent: 2004/0019174 (2004-01-01), Ichiroku et al.
patent: 0 424 940 (1991-05-01), None
patent: 54-145794 (1979-11-01), None
patent: 55-45746 (1980-03-01), None
patent: 56-27140 (1981-03-01), None
patent: 3-209478 (1991-09-01), None
patent: 10-265571 (1998-10-01), None
patent: 10-274850 (1998-10-01), None
patent: 11-65107 (1999-03-01), None
patent: 2001-335619 (2001-12-01), None

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Photo-curable resin composition comprising a polyimide, a... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Photo-curable resin composition comprising a polyimide, a..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Photo-curable resin composition comprising a polyimide, a... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-4131784

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.