Phase change memory devices employing cell diodes and...

Active solid-state devices (e.g. – transistors – solid-state diode – Bulk effect device – Bulk effect switching in amorphous material

Reexamination Certificate

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Details

C257S002000, C257S003000, C257S004000, C257SE29003, C257SE47001

Reexamination Certificate

active

07994493

ABSTRACT:
Phase change memory devices may include a semiconductor substrate of a first conductivity type and a plurality of parallel word lines disposed on the semiconductor substrate. The word lines may have a second conductivity type different from the first conductivity type and substantially flat top surfaces. First and second semiconductor patterns may be sequentially stacked on each word line, and an insulating layer may be provided to fill gap regions between the word lines, gap regions between the first semiconductor patterns and gap regions between the second semiconductor patterns. A plurality of phase change material patterns may be two-dimensionally arrayed on the insulating layer and electrically connected to the second semiconductor patterns.

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US20030186481 is English Abstract corresponding to CN1449021.
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Notice of Allowance dated May 14, 2008 in corresponding parent application U.S. Appl. No. 11/324,112.
Office Action from European Patent Office re Application No. 06002902.2 dated Feb. 14, 2011.

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