Phase-change memory device using chalcogenide compound as...

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

Reexamination Certificate

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C257S296000

Reexamination Certificate

active

07053431

ABSTRACT:
A phase-change memory device includes memory cells, a memory cell array, a first electrode layer, a word line, and a bit line. The memory cell includes a phase-change layer formed on a semiconductor substrate. The memory cell array has the memory cells arranged in a matrix. The phase change layer includes first regions which contact the semiconductor substrate in units of memory cells and a second region which connects the first regions arranged in a same column. The first electrode layer is formed on the second region. A contact area of each first region and the semiconductor substrate is smaller than a contact area of the second region and the first electrode layer. The bit line is electrically connected to the first electrode layer. The bit line is connects in common the phase-change layers of the memory cells arranged in the same column.

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Scott Tyson, et al., “Nonvolatile, High Density, High Performance Phase-Change Memory1”, IEEE, 2000, pp. 385-390.
Manzur Gill, et al., “Ovonic Unified Memory—A High-Performance Nonvolatile Memory Technology for Stand-Alone Memory and Embedded Applications”, ISSCC 2002, Session 12, TD: Digital Directions / 12.4, 7 pages.
Stefan Lai, et al., “OUM—A 180 nm Nonvolatile Memory Cell Element Technology for Stand Alone and Embedded Applications” IEEE, 2001, IEDM, pp. 803-806.

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