Phase change material for use in a phase change random...

Active solid-state devices (e.g. – transistors – solid-state diode – Bulk effect device – Bulk effect switching in amorphous material

Reexamination Certificate

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C257S003000, C257S004000, C257SE29002, C257SE29068

Reexamination Certificate

active

07956342

ABSTRACT:
Insulating impurities may be uniformly distributed over an entire or partial region of the phase change material. The PRAM may include a phase change layer including the phase change material. The insulating impurity content of the phase change material may be 0.1 to 10% (inclusive) the volume of the phase change material. The insulating impurity content of the phase change material may be adjusted by controlling the power applied to a target including the insulating impurities.

REFERENCES:
patent: 6800504 (2004-10-01), Li et al.
patent: 2004/0037179 (2004-02-01), Lee
patent: 2004/0160817 (2004-08-01), Rinerson et al.
patent: 2005/0029502 (2005-02-01), Hudgens
patent: 2005/0265072 (2005-12-01), Hart et al.
patent: 2006/0046509 (2006-03-01), Gwan-Hyeob
patent: 2006/0071244 (2006-04-01), Gutsche et al.
patent: 2007/0267620 (2007-11-01), Happ
patent: 2008/0017842 (2008-01-01), Happ et al.
Chinese Office Action dated Aug. 14, 2009 and English translation for corresponding Chinese Application No. 200610121248.9.

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