Fishing – trapping – and vermin destroying
Patent
1995-06-02
1996-11-19
Picardat, Kevin M.
Fishing, trapping, and vermin destroying
437209, 437214, 437219, 437220, H01L 2160
Patent
active
055762468
ABSTRACT:
A lead on chip (LOC) semiconductor leadframe package provides notched lead-fingers to eliminate mechanical shear-stress at the peripheral edge of a semiconductor chip. Opposite rows of substantially flat cantilevered lead-fingers are attached by double-sided adhesive tape in thermal contact with the active face of a chip. The lead-fingers are routed in personalized paths over the face of the chip to cover a large surface area to aid heat dissipation. All wirebond connections between the lead-fingers and the chip are made at a centerline connection strip running down the center of the chip. Each of the cantilevered lead-fingers has a notched portion positioned directly over the vulnerable peripheral chip edge to reduce thermal, mechanical shear-stress. Additionally, since corrosion typically follows a lead path, the notch provides increasing path length to prevent corrosive ingress over the chip face.
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Conru Harold W.
Froebel Francis E.
Gregoritsch, Jr. Albert J.
Pohl Jens G.
Rieley Sheldon C.
Amed Adel
International Business Machines - Corporation
Picardat Kevin M.
Shkurko Eugene I.
Siemens Aktiengesellschaft
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