Personalized area leadframe coining or half etching for reduced

Details Personalized area leadframe coining or half etching for reduced Personalized area leadframe coining or half etching for reduced

1995-06-02

1996-11-19

Picardat, Kevin M.

Fishing, trapping, and vermin destroying

437209, 437214, 437219, 437220, H01L 2160

Patent

active

055762468

ABSTRACT:
A lead on chip (LOC) semiconductor leadframe package provides notched lead-fingers to eliminate mechanical shear-stress at the peripheral edge of a semiconductor chip. Opposite rows of substantially flat cantilevered lead-fingers are attached by double-sided adhesive tape in thermal contact with the active face of a chip. The lead-fingers are routed in personalized paths over the face of the chip to cover a large surface area to aid heat dissipation. All wirebond connections between the lead-fingers and the chip are made at a centerline connection strip running down the center of the chip. Each of the cantilevered lead-fingers has a notched portion positioned directly over the vulnerable peripheral chip edge to reduce thermal, mechanical shear-stress. Additionally, since corrosion typically follows a lead path, the notch provides increasing path length to prevent corrosive ingress over the chip face.

REFERENCES:
patent: 4209355 (1980-06-01), Burns
patent: 4210926 (1980-07-01), Hacke
patent: 4810620 (1989-03-01), Takiar et al.
patent: 4862245 (1989-08-01), Pashby et al.
patent: 4924292 (1990-05-01), Kaufman
patent: 5068712 (1991-11-01), Murakami et al.
patent: 5227661 (1993-07-01), Heinen
patent: 5229329 (1993-07-01), Chai et al.
patent: 5304842 (1994-04-01), Farnworth et al.
patent: 5334803 (1994-08-01), Yamamura et al.
patent: 5387814 (1995-02-01), Baudouin et al.

Affiliated with

Also associated with

Rating

Personalized area leadframe coining or half etching for reduced does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Personalized area leadframe coining or half etching for reduced , we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Personalized area leadframe coining or half etching for reduced will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-540693