Peeling solution for photo- or electron beam-sensitive resin and

Details Peeling solution for photo- or electron beam-sensitive resin and Peeling solution for photo- or electron beam-sensitive resin and

1991-05-23

1992-11-24

McCamish, Marion E.

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Removal of imaged layers

430331, 134 2, 134 38, G03C 540

Patent

active

051660393

ABSTRACT:
The peeling solution for photo- or electron beam-sensitive resin according to the present invention consists of an aqueous solution comprising hydrogen peroxide and a compound represented by the general formula (I) ##STR1## wherein R.sub.1 is H or an alkyl group of 1-2 carbon atoms, R.sub.2 is H or an alkyl group of 1-3 carbon atoms, and R.sub.3 is H or an alkyl group of 1-3 carbon atoms.
The process for peeling off a photo- or electron beam-sensitive resin according to the present invention comprises a step of treating a photo- or electron beam-sensitive resin-coated substrate with a peeling solution for photo- or electron beam-sensitive resin cnsisting of an aqueous solution comprising hydrogen peroxide and a compound represented by the above general formula (I).

REFERENCES:
patent: 3175907 (1965-03-01), Fishman
patent: 3900337 (1975-08-01), Back et al.
patent: 4403029 (1983-09-01), Ward, Jr. et al.
patent: 4992108 (1991-02-01), Ward et al.
patent: 5037724 (1991-08-01), Maeda et al.

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