Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Smart card package
Reexamination Certificate
1998-10-05
2001-11-20
Clark, Jhihan B (Department: 2815)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Smart card package
C361S737000, C361S799000, C361S800000, C361S807000, C361S816000, C361S829000, C361S752000, C361S753000, C361S818000
Reexamination Certificate
active
06320252
ABSTRACT:
BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to electrical connectors and more particularly to memory cards.
2. Brief Description of Prior Developments
The Personal Computer Manufacturer Card International Association (PCMCIA) has established standards for type I, type II and type III memory cards.
Various arrangements have been suggested for fixing the upper shield to the cover shield in type II PCMCIA cards, for example, by press-fit or by gluing. Particularly with the press-fit method, difficulties may result in forming thin walled cavities in die cast materials to co-operate with the press-fit members. Consequently, it may be difficult to maintain sufficient rigidity in the structure to withstand flexing, bending and tension forces which would be expected to be placed on it in the course of ordinary use. There is, therefore, a need for a PCMCIA type II memory card which avoids the above mentioned difficulties.
SUMMARY OF THE INVENTION
In the first two embodiments the use of a plastic frame used in the prior art has been eliminated. Common to both assemblies is the use of a shielded receptacle I/O typically of the type B, mentioned in the previous write-up. The frame-less structure was chosen as means to avoid an extra component in the card kit assembly. It will, however, be appreciated that implicit in this concept is the fact that nay axial or torsional forces applied to the card, needs to be withstood directly at the (rivet) connection between PCB and the two end connectors.
In another two embodiment the PCMCIA type II card with the use of side frames or side bars as integral part of the card assembly. Another feature of these embodiments is the “slide-in” of the pre-assembled unit of the PCB with two end receptacle connectors, into a previously formed metal casing (using side frames or bars as holding means) as final assembly step. In this disclosure, the words “side frame” or “side bars” will be inter-changeably used and the differences specified in use. It needs to be mentioned that when the memory card is subjected to mechanical forces (tension pull, twist and flex) in application, these forces need to be withstood without rupture or damage to the delicate (and expensive) electronic assembly. In a frame-less design, the critical force loading areas are the junction of connectors with the PCB, which is often an area of concern for some users. Such conditions may be avoided by use of side frames or side bars as part of the assembly. The concept of “slide-in” of a fully assembled PCB including the two end connectors, gives the user a possibility of properly inspecting and if necessary, repair the module before finalizing the card assembly. These embodiments are adapted to having the final assembly undertaken at the user's premises by virtue of the assembly and the fact that tooling is relatively simple, inexpensive and user-friendly.
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Gerrits Antonius H. Johanna
Margini Sergio
Potters Paul Johannes Marinus
van den Aker Cornelis Gualtherus J.
Berg Technology Inc.
Clark Jhihan B
Page M. Richard
Reiss Steven M.
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