Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Solder wettable contact – lead – or bond
Patent
1997-07-22
2000-02-15
Chaudhuri, Olik
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Solder wettable contact, lead, or bond
257772, 257781, H01L 2348, H01L 2352, H01L 2940
Patent
active
060256494
ABSTRACT:
A solder column structure particularly useful for joining electronic components by C-4 interconnection is provided comprising a solder column attached at one end to one of the substrates being joined and having a layer of indium at the other end. During reflow, to join the other substrate, the indium melts with part of the solder column forming a Pb--Sn--In ternary alloy joint having enhanced fatigue resistance. A method for using the solder column to make electronic component assemblies and electronic component assemblies made using the method and solder column are also provided.
REFERENCES:
patent: 4412642 (1983-11-01), Fisher, Jr.
patent: 4651191 (1987-03-01), Oowe et al.
patent: 4673772 (1987-06-01), Satoh et al.
patent: 5075965 (1991-12-01), Carey et al.
patent: 5244143 (1993-09-01), Ference et al.
patent: 5251806 (1993-10-01), Agarwala et al.
patent: 5269453 (1993-12-01), Melton et al.
patent: 5308578 (1994-05-01), Wong
patent: 5496770 (1996-03-01), Park
patent: 5509815 (1996-04-01), Jin et al.
patent: 5542174 (1996-08-01), Chiu
patent: 5796591 (1998-08-01), Dalal et al.
Dawson et al., "Indium-Lead-Indium Chip Joining", IBM Tech. Disc. Bull. vol. 11, No. 11, p. 1528; Apr. 1969.
IBM Technical Disclosure Bulletin, vol. 22 No. 3 Method to Change Solder Composition of CHIP Aug., 1979.
IBM Technical Disclosure Bulletin, vol. 17 No. 4 Indium-Lead Solder for Component Mounting Sep., 1974.
Microelectronics Packaging Handbook, pp. 361-391, Edited by: Rao R. Tummaia, Eugene J. Rymaszewski 1989.
Ahsan Aziz M.
Cao Phat X.
Chaudhuri Olik
International Business Machines - Corporation
Tomaszewski John J.
LandOfFree
Pb-In-Sn tall C-4 for fatigue enhancement does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Pb-In-Sn tall C-4 for fatigue enhancement, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Pb-In-Sn tall C-4 for fatigue enhancement will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1908100